Kapco Technologies Chemistry - Soldering Fluxes and Products

Kapco Technologies developed and marketed the No Clean 23 soldering flux formulation. This chemical formulation was based upon a popular earlier flux known as the Opto Flux 30. In this line of products, solids either volatilized during the pre-heat stage of the process or are removed by the solder wave. The chemistry of the product is characterized by the non-corrosive and halide-free nature of residual chemical contaminants. Washing is therefore generally unnecessary when using this product. No Clean 23 produces markedly less visible residue and chemical fumes and provides higher SIR values. It is formulated for either foam spray or wave application.

Because this flux comprises a lower solids content, greater air pressure is necessary in using the product compared to fluxes containing higher solids content. Maximum foaming can be produced by maintaining a full flux tank, however. No Clean 23 has a relatively low surface tension compared to other products, and therefore offers superior wettability in many electronics technology applications.

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